array(1) { ["lab"]=> string(3) "859" } Novel Semiconductor Devices and Reliability Lab | 论文 | 北京工业大学 | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

大学 北京工业大学 / 信息学部
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Thermal resistance analysis related to the degradation of GaAs-Based laser diodes

2010
会议 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology

Analysis of degradation of GaN-Based light-emitting diodes

2009
会议 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

The investigation of failure mechanism of n-GaN/Ti/Al/Ni/Au ohmic contact by novel TLM

2009
会议 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Thermal analysis of ICS based on equivalent thermal resistance and skill language

2009
会议 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Thermal Analysis of the Multi-Chip Vertical Packaged White LED

2009
会议 2009 Symposium on Photonics and Optoelectronics

High-Temperature Characteristics of Ti/Al/Ni/Au Ohmic Contacts to n-GaN

2008
期刊 Chinese Physics Letters

Interface states mediated reverse leakage through metal/AlxGa1−xN∕GaN Schottky diodes

2008
期刊 Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Thermal analysis of ICs based on equivalent thermal resistance

2008
会议 2008 9th International Conference on Solid-State and Integrated-Circuit Technology

The study on the thermal behavior of packaged power LEDs

2008
会议 2008 9th International Conference on Solid-State and Integrated-Circuit Technology

A Method of Thermal Analysis for CMOS Integrated Circuit

2006
会议 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings
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