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#Ya-Min Zhang
Junction Temperature measurement of SiC BJT via the voltage drop of V<inf>BC</inf>
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Temperature distribution measurement for chips based on FPGA
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Effect of interface morphology on thermal contact resistance in thermal management of electronic devices
Novel Semiconductor Devices and Reliability Lab , 北京工业大学