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#Bing Deng
Thermal investigation of LED array with multiple packages based on the superposition method
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Evaluation of the drain—source voltage effect on AlGaAs/InGaAs PHEMTs thermal resistance by the structure function method
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Self-heating and traps effects on the drain transient response of AlGaN/GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Assessment of pulse conditions effects on reliability in GaN-based high electron mobility transistors by transient temperature measurements
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Two-dimensional transient simulations of the self-heating effects in GaN-based HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学