array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6274" } Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs - Novel Semiconductor Devices and Reliability Lab | LabXing

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Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs

2012
期刊 IEEE Photonics Technology Letters
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  • 卷 24
  • 期 5
  • 页码 398-400
  • Institute of Electrical and Electronics Engineers (IEEE)
  • ISSN: 1041-1135
  • DOI: 10.1109/lpt.2011.2179925
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