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#Guangchen Zhang
Assessment of pulse conditions effects on reliability in GaN-based high electron mobility transistors by transient temperature measurements
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Quick screen of thermal resistance for batching high brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Determination of channel temperature for AlGaN/GaN HEMTs by high spectral resolution micro-Raman spectroscopy
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Determination of Thermal Fatigue Delamination of Die Attach Materials for High-Brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal resistance analysis related to the degradation of GaAs-Based laser diodes
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal stability evaluation of die attach for high brightness LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Analysis of junction temperatures in high-power GaN-based LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Determination of channel temperature of AlGaN/GaN HEMT by electrical method
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal analysis of high power LED array system
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal Analysis of the Multi-Chip Vertical Packaged White LED
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
The study on the thermal behavior of packaged power LEDs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal analysis of ICs based on equivalent thermal resistance
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Structure optimization of heat sink for high power LED street lamp
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Analysis of degradation of GaN-Based light-emitting diodes
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Thermal analysis of ICS based on equivalent thermal resistance and skill language
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Reliability of solder joints in High-power LED package in power cycling tests
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
Effect of Self-Heating on the Drain Current Transient Response in AlGaN/GaN HEMTs
Novel Semiconductor Devices and Reliability Lab , 北京工业大学
The investigation of failure mechanism of n-GaN/Ti/Al/Ni/Au ohmic contact by novel TLM
Novel Semiconductor Devices and Reliability Lab , 北京工业大学