array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6272" } Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs - Novel Semiconductor Devices and Reliability Lab | LabXing

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Thermal Fatigue Characteristics of Die Attach Materials for Packaged High-Brightness LEDs

2012
期刊 IEEE Transactions on Components, Packaging and Manufacturing Technology
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  • 卷 2
  • 期 8
  • 页码 1346-1350
  • Institute of Electrical and Electronics Engineers (IEEE)
  • ISSN: 2156-3950
  • DOI: 10.1109/tcpmt.2012.2200295
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