#Shi-Wei Feng

Junction Temperature measurement of SiC BJT via the voltage drop of V<inf>BC</inf>

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Temperature distribution measurement for chips based on FPGA

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

All-digital thermal distribution measurement on field programmable gate array using ring oscillators

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

The degradation and recovery properties of AlGaN/GaN high-electron mobility transistors under direct current reverse step voltage stress

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Degradation and recovery property of Schottky Barrier height of AlGaN/GaN high electron mobility transistors under reverse AC electrical stress

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

A Novel Method for Measuring the Temperature in the Active Region of Semiconductor Modules

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Error Correction of Theory Model in Process-Stress Accelerated Test

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Evaluation of VDMOS Storage Failure Rate Based on Accelerated Factor

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Channel Temperature Measurement of AlGaN/GaN HEMTs by Forward Schottky Characteristics

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

Effect of interface morphology on thermal contact resistance in thermal management of electronic devices

Novel Semiconductor Devices and Reliability Lab , 北京工业大学

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