array(2) { ["lab"]=> string(3) "859" ["publication"]=> string(4) "6279" } Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method - Novel Semiconductor Devices and Reliability Lab | LabXing

Novel Semiconductor Devices and Reliability Lab

简介 A semiconductor group in BJUT

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Evaluation of thermal resistance constitution for packaged AlGaN/GaN high electron mobility transistors by structure function method

2011
期刊 Chinese Physics B
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